AAEON, an industry-leading provider of edge AI solutions, will present new platforms from across the AAEON portfolio alongside an AI vision wafer inspection demonstration at SEMICON Taiwan 2026.
- Date: September 2nd – September 4th, 2026
- Booth: #S6000, AI Technology Zone
- Venue: Taipei Nangang Exhibition Center, Hall 2 (TaiNEX 2), 4F, Taipei, Taiwan
The show, which brings together companies from across the semiconductor industry and features a range of forums, partner programs, and exhibitions, will explore how the industry’s key supply chain sectors intersect to form the backbone of the global collaboration ecosystem.
At booth S6000, AAEON will present a live AI vision wafer inspection solution designed in conjunction with leading industrial camera provider The Imaging Source and machine vision specialist Nevis, featuring the BOXER-8651AI-PLUS Embedded AI System, powered by NVIDIA Jetson Orin NX with Super Mode.
Demonstrating how precision robotics can be used in semiconductor manufacturing spaces, AAEON will also host an AI vision-driven pick-and-place robotic arm solution powered by the Intel Core Ultra Processor-based UP Xtreme i14 developer board with GMSL camera technology.
In addition to live demos, Booth S6000 will host a range of new platforms from across AAEON’s portfolio, including Single Board Computers, Computer-on-Modules, Embedded AI Systems, and Industrial Fanless Box PCs.
The most anticipated platforms from this selection are likely to be the upcoming BOXER-8740AI and MAXER-5000, which are set to be AAEON’s first products to feature new NVIDIA Jetson Thor series modules. Meanwhile, products leveraging new, innovative Intel processing architectures will also be present. Notably, the UP WCL, featuring Intel Core processors (Series 3) CPUs (formerly Wildcat Lake), will be showcased ahead of its scheduled release later this month.
For more information on the full program of events, forums, and exhibitions taking place at SEMICON Taiwan 2026, please visit the event’s official website.
