Tri-Tronics returned from PACK EXPO International 2026 with new connections, valuable industry feedback and plenty of conversations to carry forward after four busy days at McCormick Place in Chicago, October 18–21. Exhibiting at Booth S-4217 in the South Hall, the Tri-Tronics team showcased sensing solutions, rotary encoders and live product demonstrations for the packaging and processing industries.
The booth also featured an attraction that brought a different kind of competition to the show floor: The Dominator, a FANUC robot arm that challenged visitors to a game of foosball. Developed by Tri-Tronics Product Manager Dominic Gates and Applications Engineer Andrei Svistunov, The Dominator combined robotics with the company’s sensing technology. Sensors and fiber optics helped the system detect the ball’s movement, allowing the robot to react as players tried to score. Preparing for the show required significant technical development and testing before it was ready for visitors. The result was an interactive demonstration that brought people into the booth and created opportunities to talk about the technology behind the game.
Beyond the attraction, the show gave the Tri-Tronics sales team an opportunity to reconnect with existing contacts, meet new industry professionals and gather feedback on the company’s products and displays. The team also received valuable support from industry partners Bill Johnson and Jeff Johnson of RSA, Inc., Dan Weber, president of Excel Automation, and Roger Phelps of Automation Technology. Their product knowledge helped the team connect with visitors and keep conversations moving throughout the show.
The booth also drew positive feedback from visitors. Raymond Lopez Jr. of KASH Tech summed up his impression by saying, “Top 5 booth presence and display for sure!”
While the product demonstrations and booth traffic made for a productive show, the week also highlighted the teamwork behind the scenes. From building the booth and setting up displays to troubleshooting last-minute challenges and preparing The Dominator, the team worked together to bring the exhibit to life.
PACK EXPO International brings together professionals from across the packaging and processing industries to explore equipment, technologies and solutions. For Tri-Tronics, the 2026 event provided an opportunity to showcase its sensing and encoder capabilities, strengthen industry relationships and hear directly from the people who work with these technologies.
Tri-Tronics thanks everyone who visited Booth S-4217, shared feedback and took the time to connect with the team in Chicago.
